Assessment of NiPdAuAg Leadframe Rough for Delamination Stable in Electronic Packaging for Automotive

There are strong demand for Automotive segment market products for electronics component. The customer looking for small footprint of the semiconductor package like Thin Small Outline Package (TSOP). However, the TSOP package having package delamination after pre-cond MSL 1 with 3x reflow at 260°C. This paper studies the different material combination to improve and resolve the impact of package delamination. Two types of mold compound (EMC A and B) were studied along with two different type of leadframe surface finish. All samples subject to reliability assessment preconditioning MSL-1 for 168 hours (85%RH/85°C) and check using Scanning Acoustic Tomography (SAT) analysis. From all results and data gathered, it was found that EMC B showed improve delamination as compared with EMC A with CuAg lead frame. Both EMC showed zero delamination with μPPF lead frame and passed Automotive AEC Grade 0 requirements. Further verification with other assembly processes showed no major problem occur. The μPPF lead frame rough surface finish is consistently passing all assembly requirement, reliability assessment and meeting standard Automotive specification.