A Reconfigurable Interconnect Technology based on Spoof Plasmon

The bottleneck of inter-chip communication speed, for instance that between logic and memory units is a long standing issue in acquiring ultra-fast computing. While research from two extreme end of technologies: electrical, and optical interconnect have their own pitfall in constructing an energy-economic route of communication with high bandwidth density, a radically different technology named as spoof plasmon based communication may bring new insight towards addressing the issue. This technology smoothly interweaves the advantages of electrical interconnect and that of optical ones. In the present work, we have given a proof-of-concept demonstration of the signal transfer capacity of spoof plasmon parallel data-bus. We demonstrated that spoof plasmon channel can accommodate two different kinds of mode: electro-SSPP mode and opto-SSPP mode. Depending on the data-traffic, SSPP channel can be dynamically reconfigured for supporting either of the two modes for information transfer in order to minimize energy consumption. In addition, we also endeavored to answer to the question that whether the metasurface based information transfer system can be reliable in case of patterning irregularity induced by fabrication process variations.