Performance Analysis of Squarely Packed Polymorphic SWCNT Interconnect

In this paper, we propose a new configuration, named squarely packed bundle of polymorphic SWCNTs, to acquire a better performance than previously developed configuration namely hexagonally packed bundle. Subsequently, we alter the existing RLC model according to the physics based requisites of our proposed configuration. We, in the end, demonstrate a comparison among extracted RLC value and delay model of Cu and differently configured SWCNT interconnects in regards to pre-defined parameters. Having analyzed our proposed squarely packed polymorphic configuration of isolated SWCNT in SWCNT-bundle, we yield a better performance of SWCNT. In fact, using this configuration, it is depicted through simulation that SWCNT bundle can outperform copper interconnect for local level interconnect. This work reinforces further the acceptability of SWCNT as interconnect to deal with scaling issue in VLSI technologies.