Enhanced Stack-up for EMC, SI and PI in Mixed-Signal Systems

The stack-up for printed circuit boards is one of the most important factors in defining the performance. In this paper, we proposed a stack-up for a mixed-signal system that caters the problem of EMI suppression, noise, signal and power integrity. The stack-up provides two external controlled impedance layers and one buried controlled impedance layer, which may be used to route one of the power supplies rails for the analog circuits. It also has two ground layers and one layer for power supply rails with an excellent interplane capacitance. Besides this, the stack-up offers a minimum loop area and a minimum power plane noise coupling.