Electronic Packaging for MEMS Infrared Sensor With Filtered Optical Window

Sensor developments involving semiconductors techniques are even more becoming a typical vehicle for high-level of integration and in many cases are constituting a solid base for a dedicated category of Micro Electro Mechanical Systems (MEMS). In the present paper the package structure along with the System in Package (SIP) assembly details for an optical MEMS sensor are shown. An infrared sensitive structure is involved, based on semiconductor technology. The contribution of the package presence around the sensor chip and the physical interactions with sensor constitutes one of the key aspects for the overall system performance and these physical aspects are focused in the present paper. The package structure is a cavity Land Grid Array (LGA). Structural and physical characteristics of the involved materials points to match the optical signal handling as well as the electrical signal processing as output of the integrated Application-Specific Integrated Circuit (ASIC) controller. A dedicated organic substrate design, a molded-cavity structure and a Si-based IR filtering window constitutes the main features of the sensor system, in terms of concept and design boundary. Measured sensor performance and optoelectrical characterizations are finally reported, including IR opto-geometrical considerations as FFOV (Full Field Of View) results for two different package versions.