Optoelectronics module manufacturing and its prospects/barriers for assembly automation

We have developed a combination approach to solve assembly processes. We apply this approach to the system, tooling, and processes for some well-known device types, such as the 980 nm pump-LD module, pigtailed or connectorized coaxial devices, and various planar passive waveguide splitters. While there is still considerable room for refining and improving our current automation technology, it should also be emphasizes that there is a symbiotic relationship that exists between the package design, the assembly process, and the machine's capability and capacity to execute the intended design of each. That is to say, most automation equipment is simply the physical manifestation of the package design and assembly process. Without this holistic approach to solving the assembly cost problem, we are unlikely to successfully meet the ever-increasing market demands for higher quantities, lower cost, and improved quality.