Channel Modeling and Characterization for Wireless Networks-on-Chip Communications in the Millimeter Wave and Terahertz Bands

Wireless networks-on-chip (WiNoC) communications are envisioned as a promising technology to support the interconnection of hundreds of cores in the chip multi-processor design. To meet the future demand for Tera-bit-per-second (Tbps) ultra-fast links in WiNoC, the millimeter wave (mmWave) and Terahertz (THz) bands with ultra-broad spectrum resource are attractive for WiNoC communications. In this paper, a hybrid WiNoC architecture and the CMOS-based stratified chip design are described, in which the flip-chip (FC) package and heat sink are considered. In the WiNoC stratified medium, electromagnetic fields are rigorously analyzed by using Sommerfeld integration, which is verified with full-wave simulation. Based on the developed channel model, the WiNoC propagation is thoroughly characterized by analyzing the path loss, the channel capacity, and reliability. Simulation results show that 0.95 Tbps wireless link with the error rate below 10
^-14
is achievable for WiNoC communications in the mmWave and THz bands. Furthermore, the impact and guidelines of the chip design on the WiNoC wave propagation are investigated. In particular, the wave propagation performance in the THz WiNoC channel can be improved by decreasing the underfill thickness, proper choice of the silicon thickness, and inserting a bottom layer below the silicon substrate.