Assessing Enclosure Case Design on Excitation and Transmission of Vibration in Electronic Packages

The paper represents research aimed at assessing elastic and dissipation properties of enclosures on excitation and transmission of vibration in electronic packages. Once bearing parts of electronic packages, in particular printed circuit boards, receive resonant oscillations, the dynamic forces increase manifold so that they cause breakages of parts and components. In the paper, three basic problems are in objective for enclosed electronic packages forced by vibration: finding natural frequencies of printed circuit boards using estimation and test methods; assessing enclosure case design on vibration transmission to printed circuit boards installed inside; developing methods and means to reduce transmission and excitation of vibration inside the enclosure case.