Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization—Part II

Following the previous issue of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, this second part of the Transactions continues the Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization. This special section is built from selected works that were initially presented at the IEEE Workshop on Signal and Power Integrity (SPI) 2018, the IEEE Conference on Electrical Performance of Electronic Packaging Systems (EPEPS) 2018, and the IEEE Electrical Design of Advanced Packaging Systems (EDAPS) Symposium 2018. The three conferences are cosponsored by the IEEE Electronics Packaging Society (EPS) and represent the ideal forums in Europe, North America, and Asia to exchange innovative ideas and discuss the state-of-the-art research and development of electrical modeling, design, and other related fields for packaging and interconnects.