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A Reconfigurable 3-D-Stacked SPAD Imager With In-Pixel Histogramming for Flash LIDAR or High-Speed Time-of-Flight Imaging | IEEE Journals & Magazine | IEEE Xplore

A Reconfigurable 3-D-Stacked SPAD Imager With In-Pixel Histogramming for Flash LIDAR or High-Speed Time-of-Flight Imaging


Abstract:

A 256 \times 256 single-photon avalanche diode (SPAD) sensor integrated into a 3-D-stacked 90-nm 1P4M/40-nm 1P8M process is reported for flash light detection and ra...Show More

Abstract:

A 256 \times 256 single-photon avalanche diode (SPAD) sensor integrated into a 3-D-stacked 90-nm 1P4M/40-nm 1P8M process is reported for flash light detection and ranging (LIDAR) or high-speed direct time-of-flight (ToF) 3-D imaging. The sensor bottom tier is composed of a 64 \times 64 matrix of 36.72- \mu \text{m} pitch modular photon processing units which operate from shared 4\,\,\times 4 SPADs at 9.18- \mu \text{m} pitch and 51% fill-factor. A 16 \times 14 bit counter array integrates photon counts or events to compress data to 31.4 Mb/s at 30-frame/s readout over 8 I/O operating at 100 MHz. The pixel-parallel multi-event time-to-digital converter (TDC) approach employs a programmable internal or external clock for 0.56–560-ns time bin resolution. In conjunction with a per-pixel correlator, the power is reduced to less than 100 mW in practical daylight ranging scenarios. Examples of ranging and high-speed 3-D ToF applications are given.
Published in: IEEE Journal of Solid-State Circuits ( Volume: 54, Issue: 11, November 2019)
Page(s): 2947 - 2956
Date of Publication: 25 September 2019

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