Modified Tampon Printing of SMD Soldering Paste

Tis paper presents the results of a modified tampon printing applied to a soldering paste. An analysis of the tampon printing possibilities has been made for a flexible and quick solution when delivering a bonding paste to a contact pad. A method combining the high precision of paste mask printing and the ability to transfer the print to another contact site in a difficult to access area is developed. Process tools and requirements are defined. Errors at print transfer and topological formation of the transferred paste are investigated. The method is applied in industrial environment - company for electronic devices mounted with surface mounting.