Study on the noise coupling and shielding between through silicon vias

Noise coupling between through silicon vias (TSVs) degrades the performance and reliability of 3D integration systems. This paper focus on the research of noise coupling and shielding between TSVs. The impact of various structural parameters on TSV-TSV coupling is analyzed. Three types of noise shielding methods are investigated to evaluate the effectiveness of them to reduce the coupling noise. The TSV-TSV coupling coefficient are extracted from measurement results taking advantage of a proposed de-embedding method, and the effect of several design parameters on coupling coefficient is discussed.