Low-Cost Non-TSV Based 3D Packaging Using Glass Panel Embedding (GPE) for Power-Efficient, High-Bandwidth Heterogeneous Integration

This paper demonstrates a next-generation non-TSV 3D packaging architecture with small form-factors, excellent electrical performance and reliability at low cost for high-bandwidth applications. High density Logic-HBM integration, today, is built predominantly using 2.5D interposers which are fundamentally limited by long interconnect lengths, and they also are expensive as the package sizes increase. Although 3D ICs enable lowest possible latencies and power-efficiencies, they are challenged by power-delivery and thermal management issues. This paper presents, for the first time, a non-TSV based 3D architecture using Glass Panel Embedding (GPE) technology for high-density large package applications achieving excellent bandwidth and power-efficiency that are not possible in current approaches. The tailorable CTE of glass allows a reliable direct board SMT of large GPE packages that not only benefits form factor and signal speed, but also provides radical benefits to power delivery. This paper also studies the fundamental limitations of fan-out structures like warpage that limit today's mold-based fan-out packages, and through process improvements achieve <;80 μm across 100x100 mm panel enabling HBM assembly at 40 μm pitch.