Embedded Component Packaging for Wafer-Level Encapsulated and Integrated RF Mems

The ability to integrate a micro-electromechanical systems (MEMS) device within the core of a substrate or printed circuit board (PCB) creates an attractive solution for applications that require dense device integration, a high degree of customization, and/or size reduction. We have demonstrated the successful embedding of a wafer-level encapsulated, CMOS integrated RF MEMS tuner inside the fiberglass and epoxy resin core of an organic laminate substrate. The MEMS thin-film hermetic cavity has been proven to withstand the mechanical stress of substrate core lamination. RF performance was evaluated, and electrostatic discharge (ESD) protection was characterized with the integration of surface-mount passive inductor components.