Super Spatial Resolution Pressure Image Sensor Based on a Bonding Technique of Pvdf Film on Two Micrometer Pitch CMOS Potentiometric Sensor Array

Recently there has been a growing trend toward the development of touch sensing devices with a high spatial resolution in robotic field. Most of all sensors are limited due to their large device size. We have been aimed to develop a high-density and high-resolution pressure sensor array using complementary metal oxide semiconductor (CMOS) imaging technologies. To realize the pressure sensing device, we here propose a bonding technique that connects a polarized film to a 256 × 256 potentiometric sensor array and demonstrate the fabricated device.