Development of Electrically Conductive DLC Coated Aluminum Substrate for the Advanced Electric Storage Devices by Plasma Ion Assisted Deposition Method

This paper relates to the development of electrically conductive DLC coated Aluminum (Al) substrate for the advanced electric storage devices by Plasma Ion Assisted Deposition (PIAD) method. Due to its low contact resistance and high corrosion resistance capability the electrically conductive DLC coated Al substrate is confirmed to be useful as the electrode material of the electric storage devices such as EDLC, LiC, LiB, especially for the increase of the cell voltage.