Development of TCT Life Prediction Model of Solder for Power Module

Solder as an interconnection material is widely used in power semiconductor device. The solder reliability is a challenge in higher temperature operation. This work proposes a solder life prediction model based on finite element method (FEM) with solder's creep characteristics and thermal cycle experiment results. The life prediction model for SAC and Sn-Ag-Bi-In alloy are both developed in this research. Therefore, we can predict the life cycles of power module with these two kinds of solder alloy. With the solder life prediction model, the optimized design based on different materials, structures or geometries can be obtained from the simulation results and a small amount of experiments. It could shorten the development time in the module design phase.