A study on the fabrication and characterization of alumina electrostatic chuck for silicon wafer processing

Alumina electrostatic chucks for silicon wafer processing with wide range of electrical resistivity were fabricated by controlling the content of TiO/sub 2/ in alumina (0 wt%, 1.3 wt%, 2 wt%, and 2.8 wt%). The dependence of electrostatic force on applied voltage, temperature and humidity was investigated. In addition, response characteristics on applied voltage and relationship between electrical resistivity and electrostatic force characteristics such as Coulomb force and Johnsen-Rahbeck force were discussed.