Rigorous modeling of the frequency dependence of ohmic losses in high-speed electrical interconnections

A systematic methodology is presented for the development of SPICE-compatible models for printed circuit board interconnections exhibiting dispersion due to ohmic loss and skin effect. The important attributes of this methodology are: (a) a rigorous and computationally efficient approach for the extraction of the per-unit-length, frequency-dependent resistance and inductance matrices for a system of coupled interconnects. (b) The systematic development of an equivalent circuit for the discrete approximation of the generalized transmission line equations, that can be readily incorporated in standard SPICE-like circuit simulators.