Optimal Design of Heat Dissipation Structure of IGBT Modules Based on Graphene

With the emergence and rapid development of new energy vehicles, as their core devices, IGBT modules become more and more important. Heat dissipation issue is the key factor for the failure of high power IGBT modules. Due to the unique structure and excellent performance of graphene, an optimal packaging structure of IGBT modules in the new energy vehicles is proposed. It includes graphene based film put on the IGBT chip and an oval fin water-cooling radiator employed under the base plate. In this paper, the temperature distribution of IGBT chip were compared in the simulation before and after graphene based film was transferred. The cooling effects varies with many factors were investigated, such as thermal conductivity, thickness, different application position of graphene based film, and also the size and structure of the water-cooling radiator. In the optimal packaging structure, with graphene based film both on and below IGBT chip, the heat at the hotspots can be diffused all over the surface, and the highest temperature of the whole packaging structure was decreased by nearly 13°C when a 200 W power was loaded on chip.