Novel Workflow for High-Resolution Imaging of Structures in Advanced 3D and Fan-Out Packages

With the slowing of Moore’s Law, advanced packaging technologies are needed to fill the performance gap that was previously satisfied by silicon device scaling. In many cases, these advanced packaging technologies use heterogeneous integration with 3D and fan-out technologies. In consequence, advanced analytical tools and techniques are needed. In this paper, we describe a novel approach for high-resolution cross-sectional imaging of advanced 3D package structures based on 3D X-ray microscopy (3D XRM) linked with a femtosecond-laser equipped FIB-SEM system. The capabilities of this workflow are demonstrated using a multichip package having stacked die, TSVs, Cu microbumps and flip chip interconnects.