Novel Oxide Top-Off Process Enabling Reliable PC-CA TDDB on IO Devices with Self Aligned Contact

The MOL PC-CA TDDB reliability is systematically evaluated for the 1.98V IO devices with Self-Aligned Contact (SAC) and top off oxide process. Compared to the thin oxide devices, significant reliability improvement from both t63 and β can be achieved by tuning the top off oxide thickness thus making it fully compatible with the SAC process flow, with no impact to device and device reliability performance.