Comparative Stability Analysis of Pristine and AsF5 Intercalation Doped Top Contact Graphene Nano Ribbon Interconnects

In this work, a comparative stability analysis of copper (Cu), pristine and AsF5-intercalated top contact (TC) multilayer graphene nanoribbon (MLGNR) interconnect is presented. In this work, Bode stability formalism of AsF5intercalated TC-MLGNR interconnect using ABCD transmission parameter based multi-conductor transmission line model, has been presented for the first time. The variation in stability has been studied for conventional copper, pristine and AsF5 intercalated interconnect for different interconnect lengths (10μm and 100μm) and different level of edge roughness. It is shown that, AsF₅-interclation doped TCMLGNR interconnects offer better stability, for similar dimensions, than its pristine counterpart as well as conventional copper wires at local, intermediate and global interconnect for high frequency applications.