Signal Integrity and Power Integrity Challenges in Embedded Computing Boards

The demand for smaller size, lesser weight, lower power, higher performance and faster speed has set the trend for multi-threaded and multi-core CPU based embedded design. Such design are associated with various challenges which includes space constraints, trace routing constraints, length matching, signal integrity, power integrity, EMI/EMC constraints and thermal management. Systematic design approach and simulations helps to address these challenges in the design stage itself thereby reducing the time to market. The purpose of this paper is to analyze the various design challenges in High Speed embedded systems, related to Signal Integrity (SI) and Power Integrity (PI) and the practical solutions to overcome these challenges.