Improved Thermal Conductive Property of Pine Needle Derived Carbon for Thermal Management Applications

Modern electronics are seriously limited by heat dissipation. Interfacial thermal resistance and constructing thermal conductive network are found to be the key issues. In this work, pine needle-derived carbon (PNDC) was prepared by a simple carbonization method. At optimized condition 50°C for 2 hrs, it shows impressive thermal conductive property. Importantly, the systematic structural characterization indicates that this derived carbon itself has well aligned, interconnected network-like, and channel-shaped microstructure which benefits the interface contact. The resulting Ag @PNDC/epoxy composite films were fabricated via a vacuum infiltration technology, the results show a much enhanced heat transportation $(0.537 mathrm{Wm}^{-1} \mathrm{K}^{-1})$ as compared to that of pure epoxy resin $(0.187 mathrm{Wm}^{-1} \mathrm{K}^{-1})$.