Application of Micro Focus X-ray Inspection System to Electronics

In recent years, quality evaluation of manufactured products By Non-Destructive Inspection (NDI) with X-ray has been attracting attention as this method analyzes the internal structure of manufactured products two-or three-dimensionally without destroying them. This inspection method has been used for various applications such as total inspection and a root cause analysis of defective products as well as a development of new products. Electronics industry is especially one of the fields where the NDI with X-ray is widely applied [1]. This presentation introduces applications of the CT imaging to LED devices and electronic components such as failure analysis of solder joints and wires in electronic equipments using Micro Focus X-ray CT system (Shimadzu Corp.).