Development of Antenna on FO-WLP

This paper describes the process development of fan-out wafer level package (FO-WLP) package that uses mold encapsulation to form the antenna element. The FO-WLP package is designed with a target frequency of 60GHz for wireless local area network (WLAN) applications. The package consists of embedding a radio frequency integrated circuit (RFIC) chip in mold compound to form a reconstructed wafer. Redistribution layers (RDL) are then processed on the reconstructed wafer to form interconnections and excitation elements of the RF chips. The reconstructed wafer is then encapsulated with a 2^nd level mold on the RDL side and Cu patch radiators are fabricated on top of it. The 2^nd level mold will be sandwiched between the excitation elements and patch radiator and hence can function as the patch antennas for WLAN applications. Through mold vias (TMV) are then laser drilled through reconstructed wafer to form vertical interconnections with the embedded RFIC chips. The bottom RDL layer is then fabricated on the backside to function as the ground planes and solder pads for board level package assembly.