Robust/low cost solid-state remote power controller (RPC) technology is here

New commercial aircraft, satellites, tanks, and various military platforms are turning to Remote (Solid-State) Power Controllers (RPCs/SSPCs). Data Device Corporation (DDC) has observed this trend based on its years of experience supplying SSPCs for high volume M1A2 Tank production, aerospace and space programs, and while developing the latest RPC technology. There are clearly desirable features and advantages that have a profound impact on the next-generation applications. Present RPC designs have come a long way, but the future will bring improvements that will promote larger usage of RPCs in the next generation of power distribution systems. Historically, RPCs have competed with apparent-low-cost electromagnetic circuit breakers and relays. Today's RPCs offer additional system cost savings through, higher reliability, CPU interfacing, lower power dissipation, and smart circuit breaker options along with I/sup 2/T trip protection. They provide features that only solid-state switching technology can support such as no wear and tear, self test capabilities, faster circuit protection, real time computer interfacing, low maintenance, and no thermal derating. Technology has, and will, continue to play a major role in the overall performance and features realized in today's and tomorrow's RPCs. One technology often overlooked is the packaging. The package has a very important role supporting the mechanical and environmental integrity, and thermal management in the smallest possible profile. This paper will review the tradeoffs and factors that can help reduce the overall cost, available with today's RPC technology. The paper will also focus on a new packaging concept that will support all of the technical and price/performance issues that are essential to today's power distribution systems.