Study on the Inherently Safer Design Strategy of Semiconductor Process and the Improvement of Facility Safety Management Efficiency

This study uses chemical substances and products for wet etching and dry etching. In the table the etching process hazard analysis is also performed and aimed at the new project of the change system, and completed HAZOP analysis for raw of material changes and establish improvement measures. After the risk control measures established by the institute, it was found that unsafe behaviors effectively improved the focus of the "gas cylinder replacement operation" in 2017 was reduced from 24 to 8 pieces.