A hardware obfuscation technique for manufacturing a secure 3D IC

3D Integrated Circuit (3D-IC) is an emerging technology that can address many challenging problems threatening the security of the chip by split manufacturing [1]. One of the disadvantages of split manufacturing is the uncertainty in the reliability of the last foundry that is responsible for the complete bonding of tiers. In this work, we present an innovative approach that safeguard the outsourcing of the entire 3D IC manufacturing including the last bonding stage. The proposed technique not only obfuscates the design functionality but immunes the IC against Trojan insertion.