Step Cut Process of a multilayered PCB with a metal defined package edge

This study describes an innovative blade dicing process to cut through multi layered PCB's containing a minimum two layers of metal. This publication also defines a robust blade dicing process for metal defined semiconductor packages ie: having at least one metal layer extended to package edge. Due to the material properties thin copper layers in PCB's result to be very challenging to cut through during the blade dicing process used in semiconductors.