Next-Generation Nanopackaging [Guest Editorial]

The articles in this special section focus on nanopackaging to realize next generation three-dimensional (3-D) and flexible electronics with heterogeneous functional integration. Nanopackaging is defined as the packaging of devices and systems with nanoscale materials and processes for improved performance, functionality, miniaturization, reliability, and cost. It seeks to bridge the gap between integrated circuits (ICs), which are at the nanoscale, and the rest of the system components that are typically at milliscale or microscale. Nanopackaging plays a key role in all the major aspects of system integration: improved functional density, higher power densities and power efficiency, higher bandwidth with lower power, improved thermal management, and better reliability.