Submicron flip chip bonding technology for opto-electronic devices

Optic modules act as the optic/electronic interface in the high-capacity communication media which is arising due to the shift to multimedia, and in these modules, the optic elements require sub-micron mounting on the silicon substrate. Here, in contrast to the conventional 5 /spl mu/m mounting flip chip bonder, we have developed a sub-micron bonder for mounting at a high precision. We also discuss alignment technology, and a solder process for achieving high precision.