Miniaturization of Low Temperature Co-fired Ceramic Packaging for Microwave Filters

Low Temperature Co-fired Ceramic (LTCC) is a multilayer technology and of great importance in 3D packaging. Its typical wiring precision is on micron scale, which corresponds to electronic components/circuits working at lower microwave regime. As the size of electronic devices keeps shrinking, LTCC technology encounters more challenges. Apart from material and fabrication, innovation can also be made from the perspective of structure design. This paper shows examples to demonstrate a further miniaturization of LTCC microwave filters with special constructing and arranging tricks. The size reduction for optimized designs are 58.3% and 73.9%, respectively, while the electrical performance maintain comparable with that of the original ones.