Reliability Analysis of System-in-Package Module Based on Physics of Failure

With the rapid development of SiP (System in Package) technology, reliability evaluation cannot be achieved by a single theory and traditional methods. In this paper, the reliability analysis technology based on PoF (Physics of Failure) is proposed. The performance degradation modeling, experiment design and reliability estimation based on Monte Carlo method are integrated to address the problems existing in the reliability work of the high-reliability and long-life product of SiP modules. Combining with an applicative example of reliability analysis case for a SiP module of plastic package, systematic analysis was conducted, including historical failure information research, typical failure mode, highly accelerated stress tests' design, fault excitation, and failure mechanism analysis, in order to make further improvement on reliability analysis technology of SiP modules in electronic industry.