A new multi-layer AiP solution based on organic substrate

This work proposes a low-cost Antenna-in-Packaging (AiP) solution based on organic substrate for 80GHz radar application. Redistribution layer (RDL) technology is used to attach antenna to RFIC for high-precision interconnection and system level assembly. The RFIC is embedded in organic substrate. Within this single package, the antenna element, antenne feedline and I/Os of low-speed and high-speed signals are integrated in a vertical three layer structure. The antenna system is compose of 5 patches, driven by coaxial line, which operate at 80GHz with gain of 7.79dB, bandwidth of 3.4% and S11 of -21dB. The overall footprint of the proposed AiP is 5 mm × 4 mm × 0.45 mm and the whole design can be brought into 80GHz radar applications and other mmW AiP applications.