High Mechanical Dual-Interface FSID COB Package Development for 15N 3wheel Test

Dual-Interface FSID COB (Chip-On-Board) product has been widely applied in banking card. In order to verifying its mechanical performance, there is a 3Wheel test to simulate banking cards use in ATM machine. At present, the specification of 3Wheel is 100cyc pass with a force of 8N. However, it strongly recommended 100cyc pass with higher force of 15N, in latest CQM (June 2015). Existing Dual-Interface FSID COB has 3Wheel lifetime of less than 50cyc, with a force of 15N. In this paper, simulations were performed to explain mechanism of 15N 3Wheel test. It found out largest stress phase and bonding wire stress concentration. Based on this, some solutions were developed to reduce wire stress to meet 15N 3Wheel test by changing package structure, material and assembly process.