Mechanical Response of Low Silver Lead-Free Solder under Dynamic Vickers Indentations

Combined with SHPB and nano-indentation technology, this article has designed a dynamic nano-indentation experimental system to study the mechanical properties of material on micro-surface, and the dynamic inputting process of the low silver Lead-Free solder was simulated by finite element method, obtained the dynamic mechanical response of material subjected to nanoscale impact load. The results showed that: In the loading stage, the force of the specimen changes linearly with time, while in unloading, it is nonlinear. The deformation of low silver Lead-Free solder is complicated in the process of pressing, especially showing a nonlinearity in the process of loading. With the increase of the strain rate, the yield strength of the material increases gradually, which shows that the low silver Lead-Free solder still exhibits strain rate effect on the micro-surface. In addition, the dynamic elastic modulus of the material is approximately the same under different strain rates.