Failure analysis of insufficient bonding strength of electrolytic nickel gold spring soldering interface

All kinds of mobile phone products need to use metal contact spring. Some of the ENEG spring were assembled on the PCB by SMT, may be caused in the weak interface by electrical plating defects, thus prone to cracking in the process of using or even fall off. This paper expounds a relatively typical analysis case, through visual inspection, cross section analysis, thickness measurement by XRF, solderability test, porosity test and SEM&EDS analysis method, discusses the common plating quality defects of the mobile phone contact spring.