Influence of different materials on thermal stress of conical TSV

The work aims to study the thermal stresses of conical through-silicon via (TSV) with different materials. The conical TSV is studied in COMSOL software based on the multi-physical field which is coupling algorithm based on the time domain finite element method. In this paper, the thermal stress of conical TSV with three different materials under periodic pulse loading is discussed. The simulation study includes the electric field, the thermal field and the force field. This paper analyzed the effect regular of pulse frequency, oxide thickness and radius of TSV size on thermal stress. The simulation results show that, under the same pulse frequency, the thermal stress of poly-silicon materials is better than that of tungsten and copper materials in conical TSV. When the oxide thickness is more than 0.14μm,the degree of influence on the heat sensitive decreased gradually in conical TSV of copper. The change of P value (1.18~1.625) has little effect on the thermal properties of poly-silicon conical TSV.The conclusion can provide some reference for practical engineering problems.