TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing

The 3D integrated circuit is a complex structure composed of chips in multi-layers fabricated vertically and horizontally. Signal through-silicon-via (TSV) is vertical electric connection enabling to communicate and compact the functional bulk. And thermal TSV is effective to amplify the heat dissipation and reduce temperature by establishing the heat dissipation path. In this work we introduce conditional grid extension method to Integrated Multi-Commodity Min-Cost (IMCMC) problem to relieve capacity limit. Moreover, we propose thermal increase model to simulate thermal distribution and realize temperature reduction. Compared with previous work, several routing revision is adopted to make the result more accurate and reduce wire capacitance. The experimental results show the effectiveness of our algorithm on reducing temperature and optimizing congestion.