A Novel Integration of Stereolithography and Inkjet Printing for Multichip Modules with High Frequency Packaging Applications

Within this paper methods of additive manufacturing for 3D circuitry is discussed. With increasing interest in the additive manufacturing of 3D circuits, varying topologies must be explored and tested to create frameworks for how to fabricate topologies with the wide design space that is introduced with additive manufacturing and 3D printing. After discussing current methods of additive manufacturing of electronics and the current limitations of different methodologies, several topologies are discussed for the inclusion of surface mount technology components with 3D printing using inkjet printing and stereolithography, including the use of inkjet printed adhesives for placement of components. Finally, a planar inverted-F antenna is integrated into the substrate, to create a complete system for a ZigBee multi-chip module utilizing additive manufacturing techniques.