High-Density Fan-Out Technology for Advanced SiP and Heterogeneous Integration

This paper reviews the capabilities of high-density fan-out (HDFO) technology for use in advanced System-in-Package (SiP) and heterogeneous integration and presents Wafer Level SiP (WLSiP) and Wafer Level 3D (WL3D) packages for mobile, Internet-of-Things (IoT) and wearable applications and their extension into large body multi-chip modules (MCMs) targeting networking and server applications. HDFO has extended heterogeneous integration capabilities by creating new toolboxes to be discussed in this paper.