Strength Analysis of Resin Delamination of Packaging Structure of Power Module

Since the power module is composed of various parts, peeling occurs between the resin as a sealing agent and other parts due to the difference in thermal expansion coefficient between them. To evaluate this delamination, a peeling test was conducted by grasping the resin with a pudding cup shape on the substrate, and the load at the moment of peeling off the resin was measured. The author analyzed the test by using the load and to get the delamination stress at the interface. In this research, the authors proposed an evaluation approach of the peel strength of the resin of the actual power module. As a result of evaluating the stress generated in the resin by giving a temperature cycle to the power module, it was found that it is necessary to reduce the stress in anticipation of future high temperature operation. Therefore, attempts were made to reduce the stress generated in the resin by changing the mechanical property value and structure of the resin. As a result, it was confirmed that reduction in stress can be expected by changing the mechanical property value and structure of the resin.