Simulation Improved Testing of Fan-out Packaging

This paper has emphasized the warpage prediction in Fan-out Wafer Level Package (FO-WLP) and developed the Epoxy Molding Compound (EMC) material for improving the warpage performance. Owing to the significant technological advances made in recent decades, consumers expect the electronic products to become miniaturization and functionalities. The wafer-level fan-out package was promoted to have smaller package size, lighter weight, better electrical performance, higher yield and lower cost. However, the warpage control was still a critical issue when the thickness of microelectronic package was becoming thinner. In this paper, the three dimensional finite element model of FO-WLP was generated. It discusses changes in warpage of different EMC materials under same process. The simulation results showed the Film EMC has better warpage performance than Liquid and Granule. It can figure out EMC is a key to reduce warpage by change its material property and component.