Performance Comparison Between Surface-Mount and Embedded Power Modules

Increasing efficiency in power electronic circuits requires innovative cooling concepts and a low impedance connection in the power path as well as low inductance driving circuits placed as close as possible to the main power switches. A direct comparison between state-of-the-art standard surface-mount build-ups and directly embedded power switches into the printed circuit board shows the high potential of integrated electronics. Measurements at defined operating points verify improved thermal performance due to more heat spreading area as well as higher achievable switching speed.