A compact passive resonator based on through-silicon via technology for microwave applications

Based on the TSV technology, a compact passive resonator utilizing spiral inductor and coaxial TSV capacitor is proposed. And the compact stack configuration integrates the whole resonator in a microsize as small as 75μm×75μm. Furthermore, the adopted spiral inductor, coaxial TSV capacitor and resonator are characterized with equivalent circuit model. The transmission parameters from equivalent circuit models and HFSS simulation are matched very well. The proposed resonator exhibits an insertion loss below 1.0dB and a return loss over -20 dB at the center frequency of 2.7GHz in the passband. And the -3dB bandwidth of resonant peak in the resonant frequency span are within the range from 1.4GHz to 5.2GHz, which demonstrates the superior characteristic of the resonator.