Low-cost 60 GHz-band antenna-integrated transmitter/receiver modules utilizing multi-layer low-temperature co-fired ceramic technology

These millimeter-wave multi-chip modules (MCMs) carry MMICs flip-chip mounted on a low-temperature co-fired ceramic (LTCC) substrate with an integrated antenna. The LTCC technology combining thick film printing technique is widely used for low-cost, high-volume applications, but is limited to a low-frequency operation <30 GHz. This is due mainly to relatively high dielectric loss and low pattern resolution. To overcome these difficulties and to realize low-cost MCMs, the MCM includes several new concepts.