Ceramic interconnect bridge for heterogeneous multiple chip packaging

In this paper, we describe the architecture and performance of a fine pitch multiple chip heterogeneous integration solution using ceramic interconnect bridge on organic substrate package. We present the increased IO density and improvement of electrical high-speed performance on signal integrity are achievable through this novel chiplets integration scheme, where dense copper routings on small ceramic bridges are served as electrical interconnect. The cost and signal attenuation of using ceramic bridge is far better than that of a silicon bridge or a wafer interposer on substrate.