Micro-fabrication method of Au micro-wire structures on substrate by chemical printing and peeling process

In this paper, a newly developed manufacturing process of metallic micro structure arrays on a substrate is reported. This process comprises of chemical treating, sputter coating and peeling techniques. Firstly in this process, a silicon wafer mother mold of micro patterns is prepared by photolithography and dry etching technique and its micro patterns is transferred to a polymer film by hot embossing method. Then, a quartz glass is cleaned in the acetone bath and then by sputter etching before stamping process. A polymer film mold, whose surface has been patterned with the micro line structure arrays, is used to transfer directly of acetone molecular patterns onto the etched surface of quartz glass substrate. Then a substrate is coated with a gold film by the DC sputter coating method. Effect of the remarkable of acetone micro patterned to the adhesion behavior of gold film on a substrate is study experimentally. Finally, peeling technique by the vibration hot dipping technique is study. As a result, the metal films on the acetone stamped lines are removed by vibration hot dipping process, and micro-wire structure arrays are remained on the substrate. This is because of chemical stamp is effective to reduce surface energy of the substrate, and also reduce the adhesion between the Au film and substrate. Feasibility of the proposed process is confirmed by experimental study, and efficiency of the process is discussed.